- 4DS Memory and its development partner IMEC have commenced planning the initial phase of integrating 4DS’ memory technology with IMEC’s megabit platform
- The companies have completed analysis of the fourth iteration of 300 millimetre wafers
- Results further enhanced the understanding of the requirements to reproduce its memory technology
- 4DS and IMEC will integrate 4DS’s memory technology and IMEC’s megabit platform to move towards demonstrating a one megabit memory chip
4DS Memory and its development partner IMEC have commenced planning the initial phase of integrating 4DS’ memory technology with IMEC’s megabit platform.
In November 2017, 4DS entered a collaboration agreement with IMEC to develop a production-compatible process for the 300 millimetre production tools, or wafers, that memory makers use to fabricate high-density, high-volume memories.
The partners set out to use this process and IMEC’s proven memory platform to build a 4DS megabit memory chip.
Earlier this year, IMEC successfully processed the 300 millimetre wafers, which 4DS then analysed.
The analysis further enhanced the company’s understanding of the process conditions required to produce its memory on IMEC’s state-of-the-art production equipment with the characteristics needed for stand-alone storage class memory.
“Having fabricated and tested around one hundred 300mm wafers, over 4 iterations, we believe we know how to repeatedly produce our memory on state-of-the-art production equipment,” CEO and Managing Director Dr Guido Arnout said.
“We are excited to be progressing to IMEC’s megabit platform and look forward to ultimately producing a megabit memory chip,” Dr Guido continued.
Integrating the memory technology and IMEC’s megabit platform will enable 4DS to show the potential of its Interface Switching ReRAM technology for storage class memory.
Integration will include the continuous monitoring and analysis of speed, endurance, retention and yield . These are essential for high-volume memory makers to make informed decisions.
“The joint decision with IMEC to now integrate our technology with IMEC’s megabit platform represents a significant step forward, and is a credit to the hard work and dedication of Guido and his technical team,” 4DS’ Chairman Jim Dorrian said.
The companies are currently in discussions regarding the extension of their agreement. Terms of the extension are expected to be finalised in the next few weeks.
The integration will extend into calendar year 2020.