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- 4DS Memory (4DS) shares have dropped into the red after receiving results from extensive testing conducted on its memory technologies
- 4DS has completed two non-platform fabrication runs over the past 12 months and started production of a third non-platform lot in April this year
- The company is finalising a production date of the third platform lot with imec and it is expected to start in late Q3 2021
- 4DS Memory shares were down 16.3 per cent at 12:28 am AEST to trade at 18 cents
4DS Memory (4DS) shares have dropped into the red after receiving results from extensive testing conducted on its memory technologies.
The company said it had completed two non-platform fabrication runs on the memory cell technology over the past 12 months and started production of a third non-platform lot in April this year.
According to 4DS, new process breakthroughs have made its Interface Switching ReRAM technology fully compatible with high-volume dynamic random access memory and NAND production processes.
“Wafers from the third non-platform lot yielded an order of magnitude decrease in cell on-resistance, which translates into an up to one order of magnitude boost in read speed,” the company said in a statement.
“Second Platform Lot wafers demonstrated both device-scaling to imec’s minimum geometry and memory switching with an access device on 300-millimetre wafers using state-of-the-art production equipment.”
4DS said it was finalising a production date of the third platform lot with imec and is expected to start in late Q3 2021.
4DS Memory Chief Executive Officer Managing Director spoke highly of the results.
“This important milestone in 4DS’s technology development pathway allows us now to focus on doing the same for integration of our ReRAM technology into imec’s megabit memory platform,” he said.
4DS Memory shares were down 16.3 per cent at 12:28 am AEST to trade at 18 cents.
